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Datasheet Details
Part No.CWCBLPM1.S1
MfrOSRAM
Size1Mb
Pages24 pages
DescriptionCamera Flash and Video Light
Datasheet SummaryAI
1. General Information/Identification:

️· Product: Likely a single LED chip, part of a series (CBLPM1.S1). The exact model name is not directly given, but is implied.
️· Document Version: Version 1.5
️· Date: Multiple dates are referenced (2016-01-25). The datasheet itself seems dated.

2. Electrical and Optical Characteristics (Not Explicitly Listed, But Implied):

️· Not detailed: There's no table with specific voltage, current, wavelength, or luminous intensity specifications. The datasheet focuses more on the *process* of using the LED rather than its inherent properties.

3. Manufacturing & Assembly Considerations (The Primary Focus):

️· ESD Protection: The LED is protected by an ESD device connected in parallel with the LED chip. This is important for handling.
️· Soldering:
- Reflow Soldering Profile: A detailed reflow soldering profile is provided, adhering to MSL Level 1 (Moisture Sensitivity Level 2). It specifies temperatures, times, and ramp rates crucial for proper soldering. Nitrogen atmosphere soldering is recommended for best results.
- Solder Pad Design: There's a section on recommended solder pad layout.
️· Taping & Reeling:
- Tape and reel specifications are detailed for automated placement machines. Dimensions (width, pitch, etc.) are given for both the tape and the reel.
- Barcode product labels (BPL) are used for tracking.
️· Dry Packing: The LED is packaged in a "dry bag" containing desiccant and a humidity card to prevent moisture damage. This is vital due to the LED's moisture sensitivity.
️· Transportation Packing: Dimensions for the cardboard shipping box are specified.

4. Physical Characteristics:

️· Package Outline: (Not detailed visually, but referenced).
️· Weight: 8.2 mg
️· Markings: Cathode marking is present.

Overall Significance:

️· Process-Focused Datasheet: This is *not* a typical LED datasheet with just electrical and optical specifications. It’s primarily a guide for electronics manufacturers who want to integrate this LED into automated assembly lines.
️· MSL2 Compliance: The focus on dry packing and reflow profiles highlights the LED's moisture sensitivity.
️· Dated Information: The 2016 date indicates that the technology and standards referenced might be outdated. Modern manufacturing processes and materials could be different.
CWCBLPM1.S1 Datasheet with Chat AI
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  • Datasheet Details
    Part No.CWCBLPM1.S1
    ManufacturerOSRAM
    Size1Mb
    Pages24 pages
    DescriptionCamera Flash and Video Light
    Datasheet Summary AI Expand summary
    1. General Information/Identification:

    ️· Product: Likely a single LED chip, part of a series (CBLPM1.S1). The exact model name is not directly given, but is implied.
    ️· Document Version: Version 1.5
    ️· Date: Multiple dates are referenced (2016-01-25). The datasheet itself seems dated.

    2. Electrical and Optical Characteristics (Not Explicitly Listed, But Implied):

    ️· Not detailed: There's no table with specific voltage, current, wavelength, or luminous intensity specifications. The datasheet focuses more on the *process* of using the LED rather than its inherent properties.

    3. Manufacturing & Assembly Considerations (The Primary Focus):

    ️· ESD Protection: The LED is protected by an ESD device connected in parallel with the LED chip. This is important for handling.
    ️· Soldering:
    - Reflow Soldering Profile: A detailed reflow soldering profile is provided, adhering to MSL Level 1 (Moisture Sensitivity Level 2). It specifies temperatures, times, and ramp rates crucial for proper soldering. Nitrogen atmosphere soldering is recommended for best results.
    - Solder Pad Design: There's a section on recommended solder pad layout.
    ️· Taping & Reeling:
    - Tape and reel specifications are detailed for automated placement machines. Dimensions (width, pitch, etc.) are given for both the tape and the reel.
    - Barcode product labels (BPL) are used for tracking.
    ️· Dry Packing: The LED is packaged in a "dry bag" containing desiccant and a humidity card to prevent moisture damage. This is vital due to the LED's moisture sensitivity.
    ️· Transportation Packing: Dimensions for the cardboard shipping box are specified.

    4. Physical Characteristics:

    ️· Package Outline: (Not detailed visually, but referenced).
    ️· Weight: 8.2 mg
    ️· Markings: Cathode marking is present.

    Overall Significance:

    ️· Process-Focused Datasheet: This is *not* a typical LED datasheet with just electrical and optical specifications. It’s primarily a guide for electronics manufacturers who want to integrate this LED into automated assembly lines.
    ️· MSL2 Compliance: The focus on dry packing and reflow profiles highlights the LED's moisture sensitivity.
    ️· Dated Information: The 2016 date indicates that the technology and standards referenced might be outdated. Modern manufacturing processes and materials could be different.