0-RING Datasheet(PDF) - MP3V5050V

Manufacturer	Part #	Datasheet	Description
NXP Semiconductors	MP3V5050V	145Kb/11P	MP3V5050V, -50 to 0 kPa, Gauge Pressure Sensor Rev. 3.0, 09/2015
	MPXC2011DT1	107Kb/7P	MPXC2011DT1, 0 to 10 kPa, Differential, Compensated Pressure Sensor Rev. 11, 09/2015
	MPX2300DT1	106Kb/7P	MPX2300DT1, 0 to 40 kPa, Differential Compensated Pressure Sensor Rev. 11, 09/2015
	MPXM2051G	828Kb/10P	MPXM2051G, 0 to 50 kPa, Gauge Compensated Pressure Sensors Rev. 4.0, 06/2020
	MP3V5050	432Kb/15P	MP3V5050, 0 to 50 kPa, Differential, and Gauge Pressure Sensor Rev. 1.4, 12/2018
	35FS4500	1,000Kb/19P	Grade 0 safety power system basis chip with CAN flexible data transceiver Rev.1.0 - 15 December2017
	MPX53	261Kb/12P	MPX53, 0 to 50 kPa, Differential and Gauge, Uncompensated, Silicon Pressure Sensors Rev. 7.1, 07/2015
	MPX5100	496Kb/20P	MPX5100, 0 to 100 kPa, Differential, Gauge, and Absolute, Integrated, Pressure Sensors Rev. 14, 12/2018
	WCT1111DS	1Mb/38P	Compliant with the latest version Wireless Power Consortium (WPC) power class 0 specification power transmitter design Rev. 1.1 09/2016
	MPX4250D	505Kb/14P	0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 8.0-25 July 2017
	WCT101XADS	1Mb/43P	Compliant with the latest version Wireless Power Consortium (WPC) power class 0 specification power transmitter design Rev. 1.1 01/2021
	WCT101XDS	2Mb/44P	Compliant with the latest version Wireless Power Consortium (WPC) power class 0 specification power transmitter design Rev. 1.2 05/2019
	WCT1011DS	2Mb/44P	Compliant with the latest version Wireless Power Consortium (WPC) power class 0 specification power transmitter design Rev. 0 0, 9/2016
	BAT54AW.115	287Kb/11P	Planar Schottky barrier diodes with an integrated guard ring for stress protection, encapsulated in a very small SOT323 Rev. 3-20 November 2012
	BAT54C.215	302Kb/11P	Planar Schottky barrier diodes with an integrated guard ring for stress protection, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Rev. 5-5 October 2012
	PMEG6002EB115	74Kb/10P	Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in ultra small and flat lead Surface-Mounted Device (SMD) plastic packages Rev. 01-24 November 2006
	PMEG3010EP115	97Kb/13P	Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. Rev. 01-30 December 2008

0-RING Datasheet, PDF

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