| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0873400613 |
276Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, without Locating Peg, 0.76關m (30關) Gold (Au) Plating, 6 Circuits |
| 0753413223 |
317Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0873811017 |
124Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 10 Circuits, Leadfree |
| 0791077065 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 32 Circuits |
| 0791077063 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 28 Circuits |
| 0850130476 |
93Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 1關m (40關) Selective Gold (Au), 64 Circuits, Lead free |
| 0791081009 |
304Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through-Hole, 0.38關m (15關) Gold (Au) Selective Plating, 20 Circuits, Leadfree |
| 0754921033 |
282Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0780790052 |
820Kb/10P |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38關m (15關) Gold(Au) Plating |
| 0850131225 |
92Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 1關m (40關) Selective Gold (Au), 96 Circuits, Lead free |
| 0850010074 |
113Kb/4P |
2.54mm (.100) Pitch DIN 41612 Header, Style B/2, Right Angle, Through Hole, 0.6關m (24關) Selective Gold (Au), Fixing Clip available ,32 Circuits |
| 0873812218 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, with Locating Peg, 22 Circuits, Leadfree |
| 0753423223 |
319Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 16 Circuits, 1.27關m (50關) Gold (Au), Lead Free |
| 0791077216 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 34 Circuits |
| 0791077059 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 20 Circuits |
| 0873810817 |
126Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, with Locating Peg, 8 Circuits, Leadfree |
| 0791077267 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 36 Circuits |
| 0791077060 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 22 Circuits |
| 0791077254 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, 10 Circuits |
| 0757575121 |
177Kb/4P |
3.50mm (.138) Pitch, MX150??Header, Breakaway, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail |
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