MT03BOR5K201CT datasheet(24/27 Pages) WALSIN

Part #	MT03BOR5K201CT

Description	A wide selection of sizes is available

PDF	27 Pages

Scroll/Zoom	100%

Manufacturer	WALSIN [WALSIN TECHNOLOGY CORPORATION]

Direct Link	http://www.passivecomponent.com/

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24 / 27 page

Multilayer Ceramic Capacitors

Approval Sheet

Page 24 of 27

ASC_ Automotive Cap_(MT)_022N_DS

Mar. 2019

No.

AEC-Q200

Test Item

AEC-Q200 Test Condition

Requirements

18. Board Flex

AEC-Q200-005

* The middle part of substrate shall be

pressurized by means of the pressurizing

rod at a rate of about 1 mm per second until

the deflection becomes 3mm (2mm for X7R)

and then the pressure shall be maintained

for 60±1 sec.

* Measurement to be made after keeping at

room temp. for 24±2 hrs.

* No remarkable damage.

* Cap change： NPO: within ±5% or 0.5pF whichever is larger

X7R: within ±12.5%

(This capacitance change means the change of capacitance under specified flexure of

substrate from the capacitance measured before the test.)

19. Terminal Strength

AEC-Q200-006

* Pressurizing force：2N (0201 & 0402),

10N(0603), 18N(≥0805).

* Test time: 60±1 sec.

* No remarkable damage or removal of the terminations.

* Capacitance within the specified tolerance.

*

Q/D.F. value:

NPO: Cap

≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.

X7R:

Rated

vol.

D.F ≦

.

≦

Exception of D.F.

≧

100V ≦2.5%

≦

3%

≧

1206

0.47

µF

≦

5%

0603≧0.068

µF;0805＞0.1µF;1206≧1µF;1210≧2.2µF

≦

10%

0805＞0.22µF;

≧

1210

3.3

µF

50V

≦

2.5%

≦

3%

≧

0201(50V); 0603 0.047µF; 0805 0.18µF;1206 0.47µF

≦

5%

≧

0201

0.01uF; 1210 4.7µF

≦

10%

0402≧0.012

µF;0603>0.1µF; 0805>0.47µF;

1206≧2.2

µF;1210≧10µF

35V

≦

3.5% ≦10%

0603≧

≧

1µF;0805≥2.2 F;1206 2.2µF;1210 10µF

25V

≦

3.5%

≦

5%

0201≧0.01

µF;0805≧1µF;1210≧10µF

≦

7%

0603≧0.33

µF

≦

10%

≧

0201

0.1µF; 0402≧0.056µF;0603≧0.47µF;

0805≧2.2

µF; 1206≧4.7µF; 1210≧22µF

≦

12.5% 040 ≧

2

0.47

µF

16V

≦

3.5%

≦

5%

≧

0201

0.01µF;0402 0.033µF;0603 0.15µF;

≧

0805

0.68µF;1206 2.2µF;1210 4.7µF

≦

10%

0201≧0.022

µF; 0402≧ 0.22uF;0603>0.47µF;

0805≧2.2

µF;1206≧4.7µF; 1210≧22µF

10V

≦

5%

≦

10%

0201≧0.012

µF;0402≧0.22µF;0603≧0.33µF;

0805≧2.2

µF;1206≧2.2µF;1210≧22µF

≦

15%

≧

0201

0.1µF; 0402 1µF

6.3V

≦

10%

≦

15%

≧

0201

0.1µF;0402 1µF;0603 10µF;

0805≧4.7

µF; 1206≧47µF :1210≧100µF

≦

20%

≧

0402

2.2

µF

4V

≦

15%

---

20 Beam Load Test

AEC-Q200-003

* Break strength test

* Beam speed: 2.5±0.25 mm/sec

The chip endure following force

* Chip length

≤2.5mm: Thickness >0.5mm (20N), ≤0.5mm (8N)

* Chip length

≥3.2mm: Thickness ≥1.25mm (54.5N), <1.25mm (15N)

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