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STM32L4A6RG Datasheet(PDF) 199 Page - STMicroelectronics |
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STM32L4A6RG Datasheet(HTML) 199 Page - STMicroelectronics |
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199 / 282 page  DS11584 Rev 8 199/282 STM32L4A6xG Electrical characteristics 252 Figure 35. ADC accuracy characteristics Figure 36. Typical connection diagram using the ADC 1. Refer to Table 76: ADC characteristics for the values of RAIN and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (refer to Table 70: I/O static characteristics for the value of the pad capacitance). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. 3. Refer to Table 70: I/O static characteristics for the values of Ilkg. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 22: Power supply scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. |
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