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STM32L4A6VG Datasheet(PDF) 263 Page - STMicroelectronics |
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STM32L4A6VG Datasheet(HTML) 263 Page - STMicroelectronics |
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263 / 282 page  DS11584 Rev 8 263/282 STM32L4A6xG Package information 277 Figure 72. UFBGA - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package recommended footprint Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - 0.080 - - 0.0031 - eee - 0.150 - - 0.0059 - fff - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 127. UFBGA132 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Ball diameter 0.280 mm Table 126. UFBGA - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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