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STM32L4A6VG Datasheet(PDF) 268 Page - STMicroelectronics |
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STM32L4A6VG Datasheet(HTML) 268 Page - STMicroelectronics |
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268 / 282 page ![]() Package information STM32L4A6xG 268/282 DS11584 Rev 8 7.5 WLCSP100 package information Figure 79.WLCSP – 100 ball, 4.618 x 4.142 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. |
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