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STM32L433CB Datasheet(PDF) 217 Page - STMicroelectronics |
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STM32L433CB Datasheet(HTML) 217 Page - STMicroelectronics |
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217 / 225 page  DS11449 Rev 5 217/225 STM32L433xx Package information 219 7.9 Thermal characteristics The maximum chip junction temperature (TJmax) must never exceed the values given in Table 22: General operating conditions. The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max x ΘJA) Where: • TA max is the maximum ambient temperature in °C, • ΘJA is the package junction-to-ambient thermal resistance, in °C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of all IDDXXX and VDDXXX, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. 7.9.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org Table 115. Package thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient UFQFPN48 - 7 × 7 mm / 0.5 mm pitch 33 °C/W Thermal resistance junction-ambient LQFP48 - 7 × 7 mm / 0.5 mm pitch 57 Thermal resistance junction-ambient WLCSP49 3.141 x 3.127 / 0.4 mm pitch 48 Thermal resistance junction-ambient LQFP64 - 10 × 10 mm / 0.5 mm pitch 45 Thermal resistance junction-ambient UFBGA64 - 5 × 5 mm / 0.5 mm pitch 65 Thermal resistance junction-ambient WLCSP64 3.141 x 3.127 / 0.35 mm pitch 46 Thermal resistance junction-ambient LQFP100 - 14 × 14 mm / 0.5 mm pitch 42 Thermal resistance junction-ambient UFBGA100 - 7 × 7 mm / 0.5 mm pitch 57 |
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