STM32MP157D datasheet(238/259 Pages) STMICROELECTRONICS

Part #	STM32MP157D

Description	Arm® dual Cortex®-A7 800 MHz Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog

PDF	259 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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238 / 259 page

Package information

STM32MP157A/D

238/259

DS12504 Rev 5

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

7.1

TFBGA257 package information

This TFBGA is a 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch ball grid

array package

Figure 64. TFBGA257 - Outline

1. Drawing is not to scale.

2. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball

must lie within this tolerance zone

B02Y_ME_V1

Peripheral ball matrix pitch 0.5 mm

Central ball matrix pitch 0.65 mm

A1 ball pad corner

b (257 balls)

eee M C A B

fff

M C

SEATING

PLANE

ddd C

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STM32MP157D Datasheet(PDF) 238 Page - STMicroelectronics