STM32MP157F datasheet(251/260 Pages) STMICROELECTRONICS

251 / 260 page

DS12505 Rev 5

251/260

STM32MP157C/F

Package information

254

Figure 74. LFBGA448 - Recommended footprint

16.800

0.6614

17.850

18.000

18.150

0.7028

0.7087

0.7146

16.800

0.6614

0.800

0.0315

0.600

0.0236

ddd

0.120

0.0047

eee(4)

0.150

0.0059

fff(5)

0.080

0.0031

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Low profile: 1.20 mm < A ≤ 1.70 mm / Fine pitch: e < 1.00 mm pitch.

The total profile height (Dim.A) is measured from the seating plane “C” to the top of the component. The

maximum total package height is calculated by the RSS method (Root Sum Square).

A Max = A1 Typ + A3 Typ + A4 Typ + √(A1² + A3² + A4² tolerance values).

3. The typical ball diameter before mounting is 0.40 mm

4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball

must lie within this tolerance zone.

5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position

as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each

tolerance zone fff in the array is contained entirely in the respective zone eee above.

The axis of each ball must lie simultaneously in both tolerance zones.

Table 124. LFBGA448 - Recommended PCB design rules (0.8 mm pitch, BGA)

Dimension

Recommended values

Pitch

0.8 mm

Dpad

0.320 mm

Table 123. LFBGA448 - Mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

BGA_WLCSP_FT_V1

Dsm

Dpad

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