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STM32MP157C Datasheet(PDF) 249 Page - STMicroelectronics |
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STM32MP157C Datasheet(HTML) 249 Page - STMicroelectronics |
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249 / 260 page  DS12505 Rev 5 249/260 STM32MP157C/F Package information 254 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 72. TFBGA361 marking (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. MSv60331V1 xACxx Y WW Product identification R STM32MP15x Revision |
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