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STM32H750VB Datasheet(PDF) 276 Page - STMicroelectronics |
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STM32H750VB Datasheet(HTML) 276 Page - STMicroelectronics |
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276 / 337 page ![]() Electrical characteristics (rev V) STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 276/336 DS12556 Rev 6 General PCB design guidelines Power supply decoupling should be performed as shown in Figure 90 or Figure 91, depending on whether VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. Figure 90. Power supply and reference decoupling (VREF+ not connected to VDDA) 1. VREF+ input is available on all package whereas the VREF– s available only on UFBGA176+25 and TFBGA240+25. When VREF- is not available, it is internally connected to VDDA and VSSA. Figure 91. Power supply and reference decoupling (VREF+ connected to VDDA) 1. VREF+ input is available on all package whereas the VREF– s available only on UFBGA176+25 and TFBGA240+25. When VREF- is not available, it is internally connected to VDDA and VSSA. MSv50648V1 1 μF // 100 nF 1 μF // 100 nF STM32 VREF+ (1) VSSA/VREF+ (1) VDDA MSv50649V1 1 μF // 100 nF STM32 VREF+/VDDA (1) VREF-/VSSA (1) |
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