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ST25DV04K Datasheet(PDF) 155 Page - STMicroelectronics |
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ST25DV04K Datasheet(HTML) 155 Page - STMicroelectronics |
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155 / 200 page  Symbol millimeters inches (1) Min Typ Max Min Typ Max A1 - 0.095 - - 0.0037 - A2 - 0.175 - - 0.0069 - A3 - 0.025 - - 0.0010 - b - 0.185 - - 0.0073 - D - 1.649 1.669 - 0.0649 0.0657 E - 1.483 1.503 - 0.0584 0.0592 e - 0.400 - - 0.0157 - e1 - 0.800 - - 0.0315 - H - 0.346 - - 0.0136 - I - 1.039 - - 0.0409 - J - 0.200 - - 0.0079 - F - 0.314 - - 0.0124 - G - 0.342 - - 0.0135 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 85. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale recommended footprint Dpad Dsm Table 260. WLCSP10 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm ST25DV04K ST25DV16K ST25DV64K WLCSP10 package information DS10925 - Rev 9 page 155/200 |
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