STM32L151XE datasheet(133/136 Pages) STMICROELECTRONICS

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DS10002 Rev 10

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STM32L151xE STM32L152xE

Revision History

135

Revision History

Table 73. Document revision history

Date

Revision

Changes

31-Oct-2013

Initial release.

19-Feb-2014

Added Input Voltage in Table 13: General operating conditions.

Updated: Section 2.2: Ultra-low-power device continuum, Table 21:

Current consumption in Low-power sleep mode, Table 20: Current

consumption in Low-power run mode, Table 36: Flash memory and

data EEPROM endurance and retention,

Updated Ultra-Low-power Feature inside Cover Page

Updated Table 56: ADC accuracy, Table 37: EMS characteristics,

Table 38: EMI characteristics, Table 39: ESD absolute maximum

ratings, Table 42: I/O static characteristics, Table 45: NRST pin

characteristics. Added WLCSP104 recommended footprint for

package WLCSP104, removed figures “Power supply and reference

decoupling (VREF+ not connected to VDDA) and “Power supply and

reference decoupling (VREF+ connected to VDDA). Updated current

consumption values.

21-Feb-2014

Ultra low power features modification inside Cover page. Updated

Table 5: Functionalities depending on the working mode (from

Run/active down to standby), Table 58: DAC characteristics

16-May-2014

Updated IIO in Table 11: Current characteristics.

Removed note 4 in Table 61: Temperature sensor characteristics.

Added Table 41: UFBGA132 recommended footprint..

Modified pins F9 for WLCSP104 package inside Table 8:

STM32L151xE and STM32L152xE pin definitions

13-Oct-2014

Updated Section 3.17: Communication interfaces putting I2S

characteristics inside.

Updated DMIPS features in cover page and Section 2: Description.

Updated max temperature at 105°C instead of 85°C in the whole

datasheet.

Updated current consumption in Table 19: Current consumption in

Sleep mode.

Updated Table 24: Peripheral current consumption with new measured

current values.

Updated Table 57: Maximum source impedance RAIN max adding note

10-Feb-2015

Updated Section 7: Package information with new package device

marking.

Updated Figure 8: Memory map.

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