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STM32G0B1CEU6 Datasheet(PDF) 138 Page - STMicroelectronics |
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STM32G0B1CEU6 Datasheet(HTML) 138 Page - STMicroelectronics |
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138 / 159 page ![]() Package information STM32G0B1xB/xC/xE 138/159 DS13560 Rev 2 Figure 50. WLCSP52 - Recommended footprint b 0.23 0.26 0.28 0.009 0.010 0.011 D 3.06 3.09 3.12 0.120 0.122 0.123 E 3.12 3.15 3.18 0.123 0.124 0.125 e - 0.40 - - 0.016 - e1 - 2.40 - - 0.094 - e2 - 2.42 - - 0.095 - F(4) - 0.35 - - 0.014 - G(4) - 0.36 - - 0.014 - N- - 0.10 - - 0.004 aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.05 - - 0.002 ddd - - 0.05 - - 0.002 eee - - 0.58 - - 0.023 1. Values in inches are converted from mm and rounded to 3 decimal digits. 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. 3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process capability. 4. Calculated dimensions are rounded to the 3rd decimal place Table 86. WLCSP52 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max BGA_WLCSP_FT_V1 Dsm Dpad |
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