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STM32F407IG Datasheet(PDF) 165 Page - STMicroelectronics |
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STM32F407IG Datasheet(HTML) 165 Page - STMicroelectronics |
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165 / 201 page ![]() DocID022152 Rev 6 165/201 STM32F405xx, STM32F407xx Package information Device marking for WLCSP90 The following figure gives an example of topside marking and ball A1 position identifier location. Figure 77. WLCSP90 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. Table 91. WLCSP90 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed |
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