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STM32H753II Datasheet(PDF) 325 Page - STMicroelectronics |
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STM32H753II Datasheet(HTML) 325 Page - STMicroelectronics |
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325 / 361 page ![]() Package information STM32H753xI 324/360 DS12117 Rev 8 Figure 123. TFBGA100 - Recommended footprint D1 - 7.200 - 0.2835 - E 7.850 8.000 8.150 0.3091 0.3150 0.3209 E1 - 7.200 - - 0.2835 - e - 0.800 - - 0.0315 - F - 0.400 - - 0.0157 - G - 0.400 - - 0.0157 - ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 219. TFBGA100 - Recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.400 mm Dsm 0.470 mm typ (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 218. TFBGA100 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max BGA_WLCSP_FT_V1 Dsm Dpad |
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