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STM32H753II Datasheet(PDF) 347 Page - STMicroelectronics |
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STM32H753II Datasheet(HTML) 347 Page - STMicroelectronics |
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347 / 361 page ![]() Package information STM32H753xI 346/360 DS12117 Rev 8 8.8 TFBGA240+25 package information The TFBGA240+25 is a 240+25-ball, 14x14 mm, 0.8 mm pitch, fine pitch ball grid array package. Figure 140. TFBGA240+25 - Outline 1. Dimensions are expressed in millimeters. C SEATING PLANE D1 F D e A U 17 1 b (240 + 25 balls) BOTTOM VIEW e A1 ball identifier TOP VIEW A07U_ME_V2 |
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