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STM32H7B3AI Datasheet(PDF) 221 Page - STMicroelectronics |
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STM32H7B3AI Datasheet(HTML) 221 Page - STMicroelectronics |
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221 / 238 page ![]() Symbol Definition Parameter value unit ΘJC Thermal resistance junction-case Thermal resistance junction-case LQFP144 - 20 x 20 mm /0.5 mm pitch °C/W 12.6 Thermal resistance junction-case LQFP176 - 24 x 24 mm /0.5 mm pitch 11.5 Thermal resistance junction-case TFBGA100 - 8 x 8 mm /0.8 mm pitch 22.2 Thermal resistance junction-case UFBGA169 - 7 x 7 mm /0.5 mm pitch 19.9 Thermal resistance junction-case UFBGA176+25 - 10 x 10 mm /0.65 mm pitch 18.9 Thermal resistance junction-case TFBGA216 13 x 13 mm /0.8 mm pitch 22.2 Thermal resistance junction-case TFBGA225 13 x 13 mm /0.8 mm pitch 22.2 Thermal resistance junction-case WLCSP132 - 4.57 x 4.37 mm /0.35 mm pitch NA 7.11.1 Reference documents • JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. • For information on thermal management, refer to application note “Thermal management guidelines for STM32 32-bit Arm Cortex MCUs applications” (AN5036) available from www.st.com. STM32H7B3xI Thermal characteristics DS13139 - Rev 8 page 221/238 |
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