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STM32L151CB-A Datasheet(PDF) 119 Page - STMicroelectronics |
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STM32L151CB-A Datasheet(HTML) 119 Page - STMicroelectronics |
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119 / 130 page  DocID024330 Rev 5 119/130 STM32L151x6/8/B-A STM32L152x6/8/B-A Package information 129 Figure 43. UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array package recommended footprint F 0.7 0.75 0.8 0.0276 0.0295 0.0315 ddd - - 0.1 - - 0.0039 eee - - 0.15 - - 0.0059 fff - - 0.05 - - 0.002 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 69. UFBGA100 7 x 7 mm, 0.5 mm pitch, recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 68. UFBGA100 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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