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ST72324B Datasheet(PDF) 125 Page - STMicroelectronics |
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ST72324B Datasheet(HTML) 125 Page - STMicroelectronics |
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125 / 167 page  ST72324B 125/167 12.6.3.2 32K Flash and ROM devices Figure 63. Typical Application with a Crystal or Ceramic Resonator (32K Flash and ROM devices) Notes: 1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small RS value. Refer to crystal/ceramic resonator manufacturer for more details. 2. Data based on characterisation results, not tested in production. The relatively low value of the RF resistor, offers a good protection against issues resulting from use in a humid environment, due to the induced leakage and the bias con- dition change. However, it is recommended to take this point into account if the µC is used in tough humidity conditions. 3. For CL1 and CL2 it is recommended to use high-quality ceramic capacitors in the 5-pF to 25-pF range (typ.) designed for high-frequency applications and selected to match the requirements of the crystal or resonator. CL1 and CL2, are usu- ally the same size. The crystal manufacturer typically specifies a load capacitance which is the series combination of CL1 and CL2. PCB and MCU pin capacitance must be included when sizing CL1 and CL2 (10 pF can be used as a rough es- timate of the combined pin and board capacitance). Symbol Parameter Conditions Min Max Unit fOSC Oscillator Frequency 1) 116 MHz RF Feedback resistor2) 20 40 k Ω CL1 CL2 Recommended load capacitance ver- sus equivalent serial resistance of the crystal or ceramic resonator (RS) 3) fOSC= 1 to 2 MHz fOSC= 2 to 4 MHz fOSC= 4 to 8 MHz fOSC= 8 to 16 MHz 20 20 15 15 60 50 35 35 pF Symbol Parameter Conditions Typ Max Unit i2 OSC2 driving current VIN=VSS fOSC= 1 to 2 MHz fOSC= 2 to 4 MHz fOSC= 4 to 8 MHz fOSC= 8 to 16 MHz 80 160 310 610 150 250 460 910 µA OSC2 OSC1 fOSC CL1 CL2 i2 RF ST72XXX RESONATOR WHEN RESONATOR WITH INTEGRATED CAPACITORS VDD/2 Ref POWER DOWN LOGIC FEEDBACK LOOP LINEAR AMPLIFIER 1 |
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