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ST72324B Datasheet(PDF) 149 Page - STMicroelectronics |
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ST72324B Datasheet(HTML) 149 Page - STMicroelectronics |
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149 / 167 page ![]() ST72324B 149/167 13.2 THERMAL CHARACTERISTICS Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) TQFP44 10x10 TQFP32 7x7 SDIP42 600mil SDIP32 200mil 52 70 55 50 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C 1 |
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