I.MX8XLITE datasheet(15/112 Pages) NXP

Part #	I.MX8XLITE

Description	i.MX 8XLite Industrial Applications Processors

PDF	112 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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3.1.2.1 FCPBGA package thermal resistance

This table provides the FCPBGA package thermal resistance data.

Table 4. FCPBGA package thermal resistance data

Rating

Board Type1

Symbol

Value, 15

x 15 mm

package

Unit

Junction to Ambient Thermal Resistance

2

JESD51-9, 2s2p

RθJA

17.4

°C/W

Junction to Package Top Thermal

Resistance 2

JESD51-9, 2s2p

ΨJT

0.1

°C/W

Junction to Case Thermal Resistance 3

JESD51-9, 1s

RθJC

0.2

°C/W

1. Thermal test board meets JEDEC specification for this package (JESD51-9).

2. Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this

report is solely for a thermal performance comparison of one package to another in a standardized specified

environment. It is not meant to predict the performance of a package in an application-specific environment.

3. Junction-to-Case thermal resistance determined using an isothermal cold plate. Case temperature refers to the mold

surface temperature at the package top side dead center.

3.1.3 Operating Ranges

The following table provides the operating ranges of these processors.

Table 5. Operating ranges 1

Symbol

Description

Mode

Min Typ

Ma

x

Uni

t

Comments

VDD_ MEMC

Power supply of

Cortex-A35

cluster, Memory

Controller, DB,

and DRC

Overdrive 1.05 1.10 1.15

V

A35 Max frequency:

1.2 GHz

DRC Max frequency at

1.1V: 1.2GHz

DB Max frequency at

1.1V: 600 MHz

Nominal

0.95 1.00 1.10

V

A35 Max frequency:

900 MHz

DRC Max frequency at

1.0V: 933MHz

DB Max frequency at

1.0V: 466MHz

VDD_MAIN 2

Power supply of

remaining core

logic

N/A

0.95 1.00 1.10

V

M4 Max freq.: 264

MHz

Table continues on the next page...

Electrical characteristics

i.MX 8XLite Industrial Applications Processors, Rev. 3, 08/2023

15

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