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DSPIC33FJ12MC02ESS Datasheet(PDF) 232 Page - Microchip Technology

Part # DSPIC33FJ12MC02ESS
Description  High-Performance, 16-Bit Digital Signal Controllers
PDF  284 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC33FJ12MC02ESS Datasheet(HTML) 232 Page - Microchip Technology

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dsPIC33FJ12MC201/202
DS70265B-page 230
Preliminary
© 2007 Microchip Technology Inc.
23.1
DC Characteristics
TABLE 23-1:
OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ12MC201/202
3.0-3.6V
-40°C to +85°C
40
3.0-3.6V
-40°C to +125°C
35
TABLE 23-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Industrial Temperature Devices
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Operating Ambient Temperature Range
TA
-40
—
+85
°C
Extended Temperature Devices
Operating Junction Temperature Range
TJ
-40
—
+140
°C
Operating Ambient Temperature Range
TA
-40
—
+125
°C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD –
Σ IOH)
PD
PINT + PI/O
W
I/O Pin Power Dissipation:
I/O =
Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
PDMAX
(TJ – TA)/
θJA
W
TABLE 23-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 20-pin PDIP
θJA
62.4
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
θJA
60
—
°C/W
1
Package Thermal Resistance, 20-pin SSOP
θJA
108
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θJA
80.2
—
°C/W
1
Package Thermal Resistance, 28-pin QFN
θJA
32
—
°C/W
1
Note 1:
Junction to ambient thermal resistance, Theta-JA (
θJA) numbers are achieved by package simulations.



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