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PIC18F4685-I/SP Datasheet(PDF) 457 Page - Microchip Technology |
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PIC18F4685-I/SP Datasheet(HTML) 457 Page - Microchip Technology |
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457 / 484 page ![]() © 2007 Microchip Technology Inc. Preliminary DS39761B-page 455 PIC18F2682/2685/4682/4685 29.0 PACKAGING INFORMATION 29.1 Package Marking Information 28-Lead PDIP (Skinny DIP) XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F2685-I/SP 0710017 28-Lead SOIC XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F2685-E/SO 0710017 40-Lead PDIP XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F4685-I/P 0710017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e |
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