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PIC18F4685-I/SP Datasheet(PDF) 462 Page - Microchip Technology

Part # PIC18F4685-I/SP
Description  28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
PDF  484 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC18F4685-I/SP Datasheet(HTML) 462 Page - Microchip Technology

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PIC18F2682/2685/4682/4685
DS39761B-page 460
Preliminary
© 2007 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
44
Lead Pitch
e
0.80 BSC
Overall Height
A
–
–
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
7°
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.30
0.37
0.45
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
A
E
E1
D
D1
e
b
NOTE 1
NOTE 2
N
12 3
c
A1
L
A2
L1
α
φ
β
Microchip Technology Drawing C04-076B



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