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PIC12LF1501 Datasheet(PDF) 345 Page - Microchip Technology |
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PIC12LF1501 Datasheet(HTML) 345 Page - Microchip Technology |
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345 / 352 page ![]() 2011-2015 Microchip Technology Inc. DS40001607D-page 345 PIC16(L)F1503 Microchip Technology Drawing C04-211A Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Number of Pins Overall Height Terminal Width Overall Width Overall Length Terminal Length Exposed Pad Width Exposed Pad Length Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b D E2 D2 (A3) e L E N 0.50 BSC 0.15 REF 1.50 1.50 0.25 0.20 0.45 0.00 0.25 3.00 BSC 0.35 1.60 1.60 0.50 0.02 3.00 BSC MILLIMETERS MIN NOM 16 1.70 1.70 0.45 0.30 0.55 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad 16-Lead Ultra Thin Quad Flat Pack, No Lead (MV) - 3x3x0.50 mm Body (UQFN) |
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