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PIC16F753 Datasheet(PDF) 184 Page - Microchip Technology |
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PIC16F753 Datasheet(HTML) 184 Page - Microchip Technology |
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184 / 230 page ![]() PIC16F753/HV753 DS40001709C-page 184 2013-2015 Microchip Technology Inc. TABLE 22-7: THERMAL CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param No. Sym. Characteristic Typ. Units Conditions TH01 JA Thermal Resistance Junction to Ambient 84.6 °C/W 8-pin PDIP package 149.5 °C/W 8-pin SOIC package 60 °C/W 8-pin DFN 3x3mm package TH02 JC Thermal Resistance Junction to Case 41.2 °C/W 8-pin PDIP package 39.9 °C/W 8-pin SOIC package 9 °C/W 8-pin DFN 3x3mm package TH03 TJMAX Maximum Junction Temperature 150 °C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/ JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient temperature; TJ = Junction Temperature |
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