Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

Preview PDF HTML

PIC24FJ256GA705-I/M4. Datasheet(PDF) 394 Page - Microchip Technology

Part # PIC24FJ256GA705-I/M4.
Description  16-Bit General Purpose Microcontrollers with 256-Kbyte Flash and 16-Kbyte RAM in Low Pin Count Packages
PDF  412 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC24FJ256GA705-I/M4. Datasheet(HTML) 394 Page - Microchip Technology

Back Button PIC24FJ256GA705-I/M4. Datasheet HTML 390Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 391Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 392Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 393Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 394Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 395Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 396Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 397Page - Microchip Technology PIC24FJ256GA705-I/M4. Datasheet HTML 398Page - Microchip Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 394 / 412 page
background image
PIC24FJ256GA705 FAMILY
DS30010118B-page 394
 2016 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
4.70
4.70
MILLIMETERS
0.40 BSC
MIN
E
MAX
6.00
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
0.80
0.20
Microchip Technology Drawing C04-2442A-M4
NOM
48-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M4) - 6x6 mm Body [UQFN]
1
2
48
C1
Contact Pad Spacing
6.00
Contact Pad to Center Pad (X48)
G1
0.25
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
With Corner Anchors and 4.6x4.6 mm Exposed Pad
Pad Corner Radius (X 20)
R
0.10
C1
C2
EV
EV
X2
Y2
X3
Y3
Y1
E
X1
G2
G1
R
Contact Pad to Contact Pad
G2
0.20
Corner Anchor Pad Length (X4)
Corner Anchor Pad Width (X4)
Y3
X3
0.90
0.90
ØV
SILK SCREEN



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com