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STM32MP151AAA3T Datasheet(PDF) 241 Page - STMicroelectronics

Part # STM32MP151AAA3T
Description  Arm® Cortex®-A7 650 MHz Cortex®-M4 MPU, TFT, 35 comm. interfaces, 25 timers, adv. analog
PDF  245 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32MP151AAA3T Datasheet(HTML) 241 Page - STMicroelectronics

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DS12500 Rev 1
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STM32MP151A
Package information
242
Figure 70. LFBGA - 448 balls, 18x18 mm, 0.8 mm pitch, low profile fine pitch ball
grid array recommended footprint
1. Dimensions are expressed in millimeters.
D
17.900
18.000
18.100
0.7047
0.7087
0.7126
D1
-
16.800
-
-
0.6614
-
E
17.900
18.000
18.100
0.7047
0.7087
0.7126
E1
-
16.800
-
-
0.6614
-
e
-
0.800
-
-
0.0315
-
F
-
0.600
-
-
0.0236
-
ddd
-
0.120
-
-
0.0047
-
eee(3)
-
0.150
-
-
0.0059
-
fff(4)
-
0.080
-
-
0.0031
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Low profile: 1.20 mm < A ≤ 1.70 mm / Fine pitch: e < 1.00 mm pitch.
The total profile height (Dim.A) is measured from the seating plane “C” to the top of the component. The
maximum total package height is calculated by the RSS method (Root Sum Square).
A Max = A1 Typ + A2 Typ + A4 Typ + √(A1² + A2² + A4² tolerance values).
3. The typical ball diameter before mounting is 0.40 mm
4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
Table 114. LFBGA - 448 balls, recommended PCB design rules (0.8 mm pitch, BGA)
Dimension
Recommended values
Pitch
0.8 mm
Dpad
0.400 mm
Table 113. LFBGA - 448 balls, 18x18 mm, 0.8 mm pitch, low profile fine pitch ball
grid array mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
B032_LFBGA448_FP_V1
Dpad
Dsm



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