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STM32F446RC Datasheet(PDF) 193 Page - STMicroelectronics |
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STM32F446RC Datasheet(HTML) 193 Page - STMicroelectronics |
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193 / 202 page  DocID027107 Rev 6 193/202 STM32F446xC/E Package information 199 Figure 83. WLCSP81- 81-pin, 4.4084 x 3.7594 mm, 0.4 mm pitch wafer level chip scale package recommended footprint F - 0.2465 - - 0.0097 - G - 0.3075 - - 0.0121 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 116. WLCSP81 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm Table 115. WLCSP81- 81-pin, 3.693 x 3.815 mm, 0.4 mm pitch wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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