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STM32H533CE Datasheet(PDF) 216 Page - STMicroelectronics |
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STM32H533CE Datasheet(HTML) 216 Page - STMicroelectronics |
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216 / 231 page ![]() Package information STM32H533xx 216/231 DS14539 Rev 1 6.7 UFBGA100 package information (A0C2) This UFBGA is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package. Note: See list of notes in the notes section. Figure 71. UFBGA100 - Outline(13) A0C2_UFBGA_ME_V8 e D A Øb (N balls) E TOP VIEW BOTTOM VIEW 1 e A A B D1 E1 eee CA B fff Ø Ø M M C A1 ball pad corner B C E D F G H J K L M 3 24 5 7 68 9 11 10 Seating plane C A1 A2 ddd ccc C C Detail A Solder balls Mold resin Substrate (8) (DATUM A) (DATUM B) aaa C (4X) (9) SIDE VIEW DETAIL A C 12 SE SD A1 ball pad corner |
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