STM32H533CE datasheet(225/231 Pages) STMICROELECTRONICS

Part #	STM32H533CE

Description	Arm® Cortex®-M33 32-bit MCUTrustZone® FPU, 375 DMIPS 250 MHz, 512-Kbyte flash, 272-Kbyte RAM, cryptography

PDF	231 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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225 / 231 page

DS14539 Rev 1

225/231

STM32H533xx

Package information

227

integral heat slug. A distinguish feature is allowable on the bottom surface of the

package to identify the terminal A1 corner. Exact shape of each corner is optional.

e represents the solder ball grid pitch.

10. N represents the total number of balls on the BGA.

11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the

position of the centre ball(s) in the outer row or column of a fully populated matrix.

12. Values in inches are converted from mm and rounded to 4 decimal digits.

13. Drawing is not to scale.

Figure 76. UFBGA144 - Footprint example

Table 129. UFBGA144 - Example of PCB design rules (0.80 mm pitch BGA)

Dimension

Values

Pitch

0.80 mm

Dpad

0.400 mm

Dsm

0.550 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.400 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.120 mm

BGA_WLCSP_FT_V1

Dsm

Dpad

STM32H533CE Datasheet(PDF) 225 Page - STMicroelectronics