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STM32F301C6 Datasheet(PDF) 119 Page - STMicroelectronics |
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STM32F301C6 Datasheet(HTML) 119 Page - STMicroelectronics |
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119 / 141 page ![]() DS9895 Rev 8 119/141 STM32F301x6 STM32F301x8 Package information 136 WLCSP49 device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 39. WLCSP49 marking example (package top view) 1. Parts marked as ES or E or accompanied by an engineering sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 75. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. MS36423V1 F301C86 Product identification(1) Date code Y WW R Revision code |
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