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STM32L462CEU6 Datasheet(PDF) 179 Page - STMicroelectronics |
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STM32L462CEU6 Datasheet(HTML) 179 Page - STMicroelectronics |
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179 / 198 page ![]() DocID029969 Rev 1 179/198 STM32L462CE STM32L462RE STM32L462VE Package information 195 Figure 43. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. F 0.700 0.750 0.800 0.0276 0.0295 0.0315 ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 90. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 89. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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