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ST72325 Datasheet(PDF) 178 Page - STMicroelectronics |
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ST72325 Datasheet(HTML) 178 Page - STMicroelectronics |
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178 / 196 page ![]() 178/196 13.2 THERMAL CHARACTERISTICS Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the applica- tion. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) LQFP64 10x10 LQFP48 7x7 LQFP44 10x10 SDIP42 LQFP32 7x7 SDIP32 50 80 52 55 70 50 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C |
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