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H8S2245 Datasheet(PDF) 813 Page - Renesas Technology Corp |
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H8S2245 Datasheet(HTML) 813 Page - Renesas Technology Corp |
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813 / 818 page ![]() Appendix H Package Dimensions Rev.3.00 Mar. 26, 2007 Page 771 of 772 REJ09B0355-0300 Appendix H Package Dimensions The package dimension that is shown in the Renesas Semiconductor Package Data Book has priority. NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. *1 *3 p D D F 100 125 26 76 75 51 50 xM y Z D H b Terminal cross section p 1 b b 1 Detail F L L 1.0 1.0 0.08 0.10 0.5 8° 0° 0.25 0.12 0.15 0.20 0.00 0.27 0.22 0.17 0.22 0.17 0.12 3.05 16.3 16.0 15.7 L1 ZE ZD y x c b1 bp A HD A2 E D A1 c1 e e L HE 0.7 0.5 0.3 Max Nom Min Dimension in Millimeters Symbol Reference 14 2.70 16.3 16.0 15.7 1.0 14 θ θ P-QFP100-14x14-0.50 1.2g MASS[Typ.] FP-100B/FP-100BV PRQP0100KA-A RENESAS Code JEITA Package Code Previous Code Figure H.1 FP-100B Package Dimensions |
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