PIC24F16KA102 datasheet(214/254 Pages) MICROCHIP

214 / 254 page

PIC24F16KA102 FAMILY

DS39927B-page 212

Preliminary

29.1

DC Characteristics

FIGURE 29-1:

PIC24F16KA102 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

TABLE 29-1:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD –

Σ IOH)

PINT + PI/O

I/O Pin Power Dissipation:

PI/O =

Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

θJA

Frequency

1.80V

32 MHz

3.60V

3.00V

3.60V

8 MHz

3.00V

Note:

For frequencies between 8 MHz and 32 MHz, FMAX = 20 MHz *(VDD – 1.8) + 8 MHz.

TABLE 29-2:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 20-Pin PDIP

θJA

62.4

—

°C/W

Package Thermal Resistance, 28-Pin SPDIP

θJA

—

°C/W

Package Thermal Resistance, 20-Pin SSOP

θJA

108

—

°C/W

Package Thermal Resistance, 28-Pin SSOP

θJA

—

°C/W

Package Thermal Resistance, 20-Pin SOIC

θJA

—

°C/W

Package Thermal Resistance, 28-Pin SOIC

θJA

80.2

—

°C/W

Package Thermal Resistance, 20-Pin QFN

θJA

—

°C/W

Package Thermal Resistance, 28-Pin QFN

θJA

—

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-JA (

θJA) numbers are achieved by package simulations.

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