PIC18F23K22-ESLASHML datasheet(426/492 Pages) MICROCHIP

426 / 492 page

PIC18(L)F2X/4XK22

DS41412B-page 426

Preliminary

 2010 Microchip Technology Inc.

D017

DAC

A

1.8V

A

3.0V

A

1.8V

A

3.0V

A

5.0V

D018

FVR

A

1.8V

A

3.0V

A

1.8V

A

3.0V

100

A

5.0V

27.2

DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)

PIC18LF2X/4XK22

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

 TA  +125°C

PIC18F2X/4XK22

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

 TA  +125°C

Param

No.

Device Characteristics

Typ

+25°C

Typ

+60°C

Max

+85°C

Max

+125°C

Units

Conditions

VDD

Notes

Note 1:

The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is

measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS

and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-

tion will be less than the sum of both specifications.

A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the

FRC turn off as soon as conversion (if any) is complete.

PIC18F23K22-E/ML Datasheet(PDF) 426 Page - Microchip Technology

PIC18F23K22-E/ML Datasheet(HTML) 426 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL