ST72325AR9B3 datasheet(196/197 Pages) STMICROELECTRONICS

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ST72325xx

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16 REVISION HISTORY

Table 33. Revision History

Date

Revision

Description of Changes

26-Sep-2005

Initial release

04-Dec-2006

Modified LQFP48 pinout, added S device ordering information

Modified Note 4 on page 16 for unbonded pins in 48 pin C devices

Added caution about reset vector in unprogrammed Flash devices in Section 6.3.

Removed EMC protective circuitry in Figure 88 on page 163 (device works correctly without

these components)

Modified SS min. setup time and added note 4 to section 12.11.1 on page 166

Modifed description PKG1 bit in “FLASH OPTION BYTES” on page 181

Added “TIMD set simultaneously with OC interrupt” on page 194

04-Apr-2007

In Table 2 added note 5 for I/O Port E2 (PE2) output mode “pull-up always activated” and

added note 6 on connection of power and ground pins.

Deleted the sentence in Section 4.3.1 ‘Readout protection is not supported if LVD is enabled

Added Package dimensions for LQFP64 14 x14 in Figure 122

Specified EMI data for LQFP64 in Section 12.7.2

Added ‘Pull-up always active on PE2’ in Section 15.1.8

07-Oct-2008

Title of the document changed

Modified Table 1 on page 1

Modified “Starting the Conversion” on page 133

Modified tRET and NRW values in “FLASH Memory” on page 155

Modified “Absolute Maximum Ratings (Electrical Sensitivity)” on page 158

Values in inches rounded to 4 decimal digits (instead of 3) in “PACKAGE MECHANICAL DA-

TA” on page 174

Removed reference to “Application with a Crystal or Ceramic Resonator for ROM (LQFP64

or any 48/60K ROM)” on page 151

Modified “PACKAGE CHARACTERISTICS” on page 174 (Section 13.3)

Modified “TIMD set simultaneously with OC interrupt” on page 194

Modified Section 14.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUS-

TOMER CODE on page 183 (Figure 106 and option lists)

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