900844 datasheet(116/118 Pages) FREESCALE

Part #	900844

Description	Integrated Power Management IC for Ultra-mobile and Embedded Applications

PDF	118 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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116 / 118 page

Analog Integrated Circuit Device Data

116

Freescale Semiconductor

900844

PACKAGING

PACKAGE DIMENSIONS

PACKAGE MECHANICAL OUTLINE DRAWING

The package style is an 11x11 fine interstitial pitch, thin profile PBGA. The package has a semi populated matrix that includes

338 balls. The ball count includes 322 assigned signal pins and four sets of 4 corner balls.

PACKAGE ASSEMBLY RECOMMENDATIONS

For improved protection against mechanical shock, Freescale recommends applying corner glue to the mounted 900844

MAPBGA package. This corner glue application is described in the AN3954 - "PCB Layout Guidelines for SC900841 and

SCCSP900842" application note.

Freescale’s preferred material for the corner glue application is the Loctite 3128 board level adhesive, applied at a 0° or 45°

dispense angle in a continuous motion, and with the fillet length extended to a minimum of 3 ball rows and columns, at each

corner.

900844 Datasheet(PDF) 116 Page - Freescale Semiconductor, Inc