AFS090 datasheet(321/334 Pages) MICROSEMI

321 / 334 page

Fusion Family of Mixed Signal FPGAs

R e visio n 2

5 -5

v2.0, Revision 1

(July 2009)

In the "128-Bit AES Decryption" section, FIPS-192 was incorrect and changed to

FIPS-197.

2-230

The note in Table 2-84 • Fusion Standard and Advanced I/O Attributes vs. I/O

Standard Applications was updated.

2-158

For 1.5 V LVCMOS, the VIL and VIH parameters, 0.30 * VCCI was changed to 0.35 *

VCCI and 0.70 * VCCI was changed to 0.65 * VCCI in Table 2-86 • Summary of

Maximum and Minimum DC Input and Output Levels Applicable to Commercial and

Industrial Conditions, Table 2-87 • Summary of Maximum and Minimum DC Input

and Output Levels Applicable to Commercial and Industrial Conditions, and

Table 2-88 • Summary of Maximum and Minimum DC Input and Output Levels

Applicable to Commercial and Industrial Conditions.

In Table 2-87 • Summary of Maximum and Minimum DC Input and Output Levels

Applicable to Commercial and Industrial Conditions, the VIH max column was

updated.

2-166 to

2-167

Table 2-89 • Summary of Maximum and Minimum DC Input Levels Applicable to

Commercial and Industrial Conditions was updated to include notes 3 and 4. The

temperature ranges were also updated in notes 1 and 2.

2-167

The titles in Table 2-92 • Summary of I/O Timing Characteristics – Software Default

Settings to Table 2-94 • Summary of I/O Timing Characteristics – Software Default

Settings were updated to "VCCI = I/O Standard Dependent."

2-169 to

2-170

Below Table 2-98 • I/O Short Currents IOSH/IOSL, the paragraph was updated to

change 110°C to 100°C and three months was changed to six months.

2-174

Table 2-99 • Short Current Event Duration before Failure was updated to remove

110°C data.

2-176

In Table 2-101 • I/O Input Rise Time, Fall Time, and Related I/O Reliability,

LVTTL/LVCMOS rows were changed from 110°C to 100°C.

2-176

VCC33PMP was added to Table 3-1 • Absolute Maximum Ratings. In addition,

conditions for AV, AC, AG, and AT were also updated.

3-1

VCC33PMP was added to Table 3-2 • Recommended Operating Conditions. In

addition, conditions for AV, AC, AG, and AT were also updated.

3-3

Table 3-5 • FPGA Programming, Storage, and Operating Limits was updated to

include new data and the temperature ranges were changed. The notes were

removed from the table.

3-5

Table 3-6 • Package Thermal Resistance was updated to include new data.

3-7

In EQ 4 to EQ 6, the junction temperature was changed from 110°C to 100°C.

3-8 to 3-8

Table 3-8 • AFS1500 Quiescent Supply Current Characteristics through Table 3-11 •

AFS090 Quiescent Supply Current Characteristics are new and have replaced the

Quiescent Supply Current Characteristics (IDDQ) table.

3-10 to

3-16

In Table 3-14 • Different Components Contributing to the Dynamic Power

Consumption in Fusion Devices, the power supply for PAC9 and PAC10 were

changed from VMV/VCC to VCCI.

3-22

In Table 3-15 • Different Components Contributing to the Static Power Consumption

in Fusion Devices, the power supply for PDC7 and PDC8 were changed from

VMV/VCC to VCCI. PDC1 was updated from TBD to 18.

3-23

The "QN108" table was updated to remove the duplicates of pins B12 and B34.

4-2

Revision

Changes

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AFS090 Datasheet(PDF) 321 Page - Microsemi Corporation

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