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DSPIC33FJMC302ESS Datasheet(PDF) 318 Page - Microchip Technology |
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DSPIC33FJMC302ESS Datasheet(HTML) 318 Page - Microchip Technology |
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318 / 330 page ![]() dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 DS70283K-page 318 © 2007-2012 Microchip Technology Inc. Section 24.0 “Electrical Characteristics” Added the 28-pin SSOP Thermal Packaging Characteristics (see Table 24-3). Removed Note 4 from the DC Temperature and Voltage Specifications (see Table 24-4). Updated the maximum value for parameter DI19 and added parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input Specifications (see Table 24-9). Updated Note 3 of the PLL Clock Timing Specifications (see Table 24-17). Removed Note 2 from the AC Characteristics: Internal RC Accuracy (see Table 24-18). Updated the characteristic description for parameter DI35 in the I/O Timing Requirements (see Table 24-20). Updated all SPI specifications (see Table 24-32 through Table 24-39 and Figure 24-14 through Figure 24-21). Added Note 4 to the 12-bit mode ADC Module Specifications (see Table 24-43). Added Note 4 to the 10-bit mode ADC Module Specifications (see Table 24-44). Section 25.0 “High Temperature Electrical Characteristics” Updated all ambient temperature and range values to +150ºC throughout the chapter. Updated the storage temperature and range to +160ºC. Updated the maximum junction temperature from +145ºC to +155ºC. Updated Note 1 in the PLL Clock Timing Specifications (see Table 25-10). Added Note 3 to the 12-bit Mode ADC Module Specifications (see Table 25-17). Added Note 3 to the 10-bit Mode ADC Module Specifications (see Table 25-18). Section 26.0 “Packaging Information” Added the 28-Lead SSOP package information (see Section 26.1 “Package Marking Information” and Section 26.2 “Package Details”). “Product Identification System” Added the “SS” definition for the SSOP package. TABLE A-6: MAJOR SECTION UPDATES (CONTINUED) Section Name Update Description |
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