DSPIC33FJ12GP201TESLASHML datasheet(215/242 Pages) MICROCHIP

215 / 242 page

Preliminary

DS70264B-page 213

dsPIC33FJ12GP201/202

FIGURE 21-12:

SPIx MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS

SP30

TdoF

SDOx Data Output Fall Time(3)

—

See parameter D032

SP31

TdoR

SDOx Data Output Rise Time(3)

—

See parameter D031

SP35

TscH2doV,

TscL2doV

SDOx Data Output Valid after

SCKx Edge

—

SP40

TdiV2scH,

TdiV2scL

Setup Time of SDIx Data Input

to SCKx Edge

—

SP41

TscH2diL,

TscL2diL

Hold Time of SDIx Data Input

to SCKx Edge

—

SP50

TssL2scH,

TssL2scL

SSx

↓ to SCKx ↑ or SCKx Input

120

—

SP51

TssH2doZ SSx

↑ to SDOx Output

High-Impedance(3)

—

SP52

TscH2ssH

TscL2ssH

SSx after SCKx Edge

1.5 TCY +40

—

TABLE 21-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS (CONTINUED)

AC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for Industrial

-40°C

≤ TA ≤ +125°C for Extended

Param

No.

Symbol

Characteristic(1)

Min

Typ(2)

Max

Units

Conditions

Note 1:

These parameters are characterized but not tested in manufacturing.

Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.

Assumes 50 pF load on all SPIx pins.

SSx

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDI

SP50

SP60

SDIx

SP30,SP31

MSb

Bit 14 - - - - - -1

LSb

SP51

MSb In

Bit 14 - - - -1

LSb In

SP35

SP52

SP73

SP72

SP73

SP71

SP70

SP40

SP41

Note: Refer to Figure 21-1 for load conditions.

DSPIC33FJ12GP201TE/ML Datasheet(PDF) 215 Page - Microchip Technology

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