DSPIC33FJ12GP201TESLASHML datasheet(193/242 Pages) MICROCHIP

193 / 242 page

Preliminary

DS70264B-page 191

dsPIC33FJ12GP201/202

21.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC33FJ12GP201/202 electrical characteristics. Additional information will be

provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the dsPIC33FJ12GP201/202 family are listed below. Exposure to these maximum rating

conditions for extended periods can affect device reliability. Functional operation of the device at these or any other

conditions above the parameters indicated in the operation listings of this specification is not implied.

Absolute Maximum Ratings(1)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V)

Voltage on any digital-only pin with respect to VSS .................................................................................. -0.3V to +5.6V

Voltage on VDDCORE with respect to VSS ................................................................................................ 2.25V to 2.75V

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin(2)...........................................................................................................................250 mA

Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA

Maximum output current sourced by any I/O pin(3)...................................................................................................4 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports(2)...............................................................................................................200 mA

Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods can affect device reliability.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 21-2).

3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGCx

and PGDx pins, which are able to sink/source 12 mA.

DSPIC33FJ12GP201TE/ML Datasheet(PDF) 193 Page - Microchip Technology

DSPIC33FJ12GP201TE/ML Datasheet(HTML) 193 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL