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DSPIC30F2011AT-30I/PF Datasheet(PDF) 220 Page - Microchip Technology

Part # DSPIC30F2011AT-30I/PF
Description  High-Performance, 16-Bit Digital Signal Controllers
PDF  238 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC30F2011AT-30I/PF Datasheet(HTML) 220 Page - Microchip Technology

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dsPIC30F6011A/6012A/6013A/6014A
DS70143C-page 218
Preliminary
© 2006 Microchip Technology Inc.
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
F
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
A
A1
A2
α
CH x 45°
1.10
1.00
.043
.039
1.14
0.89
0.64
.045
.035
.025
CH
Pin 1 Corner Chamfer
1.00 REF.
.039 REF.
F
Footprint
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
80
80
Pitch
p
.020 BSC
0.50 BSC
Overall Height
A
.047
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Foot Angle
φ
0°
3.5°
7°
0°
3.5°
7°
Overall Width
E
.551 BSC
14.00 BSC
Overall Length
D
.551 BSC
14.00 BSC
Molded Package Width
E1
.472 BSC
12.00 BSC
Molded Package Length
D1
.472 BSC
12.00 BSC
Pins per Side
n1
20
20
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.007
.009
.011
0.17
0.22
0.27
Mold Draft Angle Top
α
5°
10°
15°
5°
10°
15°
Mold Draft Angle Bottom
β
5°
10°
15°
5°
10°
15°
Notes:
JEDEC Equivalent: MS-026
Revised 07-22-05
* Controlling Parameter
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
See ASME Y14.5M
See ASME Y14.5M
Drawing No. C04-092



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