I2CSTAT datasheet(150/210 Pages) MICROCHIP

150 / 210 page

dsPIC30F2011/2012/3012/3013

DS70139G-page 150

20.1

DC Characteristics

TABLE 20-1:

OPERATING MIPS VS. VOLTAGE

VDD Range

Temp Range

Max MIPS

dsPIC30FXXX-30I

dsPIC30FXXX-20E

4.5-5.5V

-40°C to 85°C

—

4.5-5.5V

-40°C to 125°C

—

3.0-3.6V

-40°C to 85°C

—

3.0-3.6V

-40°C to 125°C

—

2.5-3.0V

-40°C to 85°C

—

TABLE 20-2:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

dsPIC30F201x-30I

dsPIC30F301x-30I

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

dsPIC30F201x-20E

dsPIC30F301x-20E

Operating Junction Temperature Range

-40

—

+150

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal chip power dissipation:

PINT + PI/O

I/O Pin power dissipation:

Maximum Allowed Power Dissipation

PDMAX

(TJ - TA) /

θJA

PINT

VDD

IDD

IOH

∑

–

()

PI/O

VDD

VOH

–

{} IOH

()

∑

VOL

I OL

()

∑

TABLE 20-3:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 18-pin PDIP (P)

θJA

—

°C/W

Package Thermal Resistance, 18-pin SOIC (SO)

θJA

—

°C/W

Package Thermal Resistance, 28-pin SPDIP (SP)

θJA

—

°C/W

Package Thermal Resistance, 28-pin (SOIC)

θJA

—

°C/W

Package Thermal Resistance, 44-pin QFN

θJA

—

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-ja (

θJA) numbers are achieved by package simulations.

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