PIC17C752-08SLASHCL datasheet(238/328 Pages) MICROCHIP

238 / 328 page

PIC17C7XX

DS30289A-page 238

Preliminary

D021

IPD

Power-down Current

(Note 3)

–< 1

µAVDD = 5.5V, WDT disabled

Module Differential

Current

D023

∆IBOR

BOR circuitry

–

150

300

µAVDD = 4.5V, BODEN

enabled

D024

∆IWDT

Watchdog Timer

–

µAVDD = 5.5V

D026

∆IAD

A/D converter

–

µAVDD = 5.5V, A/D not con-

verting

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40˚C

≤ TA ≤ +85˚C for industrial and

0˚C

≤ TA ≤ +70˚C for commercial

Param.

No.

Sym

Characteristic

Min

Typ†

Max

Unit

Conditions

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD or VSS, T0CKI = VDD,

MCLR = VDD; WDT disabled.

Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads needs to be con-

sidered.

For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as:

VDD /(2

• R).

For capacitive loads, the current can be estimated (for an individual I/O pin) as (CL

• VDD) • f

CL = Total capacitive load on the I/O pin; f = average frequency the I/O pin switches.

The capacitive currents are most signiﬁcant when the device is conﬁgured for external execution (includes

extended microcontroller mode).

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

4: For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.

5: This is the voltage where the device enters the Brown-Out-Reset. When BOR is enabled, the device (-16)

will operate correctly to this trip point.

PIC17C752-08/CL Datasheet(PDF) 238 Page - Microchip Technology

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