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PIC17C752-08/CL Datasheet(PDF) 278 Page - Microchip Technology |
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PIC17C752-08/CL Datasheet(HTML) 278 Page - Microchip Technology |
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278 / 328 page  PIC17C7XX DS30289A-page 278 © 1998 Microchip Technology Inc. Package Type: K04-049 68-Lead Plastic Leaded Chip Carrier (L) – Square MIN Mold Draft Angle Bottom Mold Draft Angle Top J-Bend Inside Radius Shoulder Inside Radius Upper Lead Length Lower Lead Width Upper Lead Width Lead Thickness Pins along Width Footprint Length Footprint Width Molded Pack. Length Molded Pack. Width Overall Pack. Length Overall Pack. Width Corner Chamfer (other) Corner Chamfer (1) Side 1 Chamfer Dim. Shoulder Height Overall Pack. Height Standoff Pitch c β α R2 R1 L B B1† n1 D2 E2 D‡ E‡ D1 E1 CH2 CH1 A3 A2 A1 A e1 Number of Pins Dimension Limits Units n 0.012 0.010 0.008 0.025 0.005 0.058 0.018 0.029 0 0.015 0.003 0 0.050 0.015 0.026 10 5 0.035 0.010 0.065 0.021 0.031 510 17 0.920 0.920 0.954 0.954 0.990 0.990 0.005 0.045 0.026 0.025 0.103 0.175 0.050 0.910 0.910 0.950 0.950 0.985 0.985 0.017 0.000 0.035 0.021 0.095 0.165 0.930 0.930 0.958 0.958 0.995 0.995 0.010 0.055 0.031 0.032 0.110 0.185 0.30 0.25 0.20 0 0.38 0.08 1.27 0.38 0.66 0 10 5 5 0.64 0.13 0.46 0.72 1.46 10 0.89 0.25 0.53 1.65 0.79 23.37 23.37 24.23 24.23 25.15 25.15 24.13 24.13 25.02 25.02 23.11 23.11 0.89 0.53 0.43 2.41 4.19 0.00 17 23.62 23.62 24.33 24.33 25.27 25.27 0.62 0.66 1.14 0.13 2.60 4.45 1.27 0.81 1.40 0.25 0.79 4.70 2.79 68 NOM INCHES* MAX NOM MILLIMETERS MIN 68 MAX 1 CH2 x 45 ° n CH1 x 45 ° 2 β R2 A1 R1 c E2 D1 D # leads = n1 E1 E α p L B A3 A2 A B1 32 ° D2 * Controlling Parameter. † Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003” (0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.” ‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions “D” or “E.” |
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