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PIC16F84A-10/SS Datasheet(PDF) 109 Page - Microchip Technology |
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PIC16F84A-10/SS Datasheet(HTML) 109 Page - Microchip Technology |
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109 / 124 page ![]() PIC16F8X © 1998 Microchip Technology Inc. DS30430C-page 109 13.0 PACKAGING INFORMATION 13.1 Package Marking Information Legend: XX...X Microchip part number & customer specific information* AA Year code (last two digits of calendar year) BB Week code (week of January 1 is week ‘01’) C Facility code of the plant at which wafer is manufactured C = Chandler, Arizona, U.S.A., S = Tempe, Arizona, U.S.A. D Mask revision number E Assembly code of the plant or country of origin in which part was assembled Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev# and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 18L PDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX AABBCDE AABBCDE XXXXXXXXXXXX XXXXXXXXXXXX 18L SOIC Example PIC16F84-04I/P 9632SAW XXXXXXXXXXXX 9648SAN /SO PIC16F84-04 Example |
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